Chip Fabrication

Chip Tapeout & MPW Shuttle Booking

Reserve your die space on an upcoming multi-project wafer shuttle run. Compare foundry nodes, lead times, and cadence, then submit a structured tapeout request through the booking flow.

MPW Shuttle Booking

Browse live shuttle runs across partner foundries, check die area availability, and submit your tapeout package for review.

Open Shuttle Booking →

Upcoming Shuttle Runs

NodeFoundry RouteCadenceLead TimeStatus
180nmSCL Mohali / Domestic MPWQuarterly12–16 weeksOpenReserve →
130nm – 90nmPartner Foundry (Asia-Pac MPW)Bi-monthly10–14 weeksOpenReserve →
65nm – 40nmGlobal Foundry ConsortiumMonthly8–12 weeksWaitlistReserve →
28nmGlobal Foundry ConsortiumScheduled16–20 weeksEnquireReserve →

Tapeout Submission Requirements

  • GDSII or OASIS layout, DRC/LVS clean against target PDK
  • Signed foundry NDA / MPW participation agreement
  • Die area reservation within shuttle floorplan allocation
  • Pad frame and ESD compliance per foundry I/O library
  • Final tapeout package: GDS, LEF/DEF, timing reports, doc sign-off
Need help preparing your tapeout package or estimating fab economics for a shuttle run? Learning module M15 — Semiconductor Fab Economics & DES Simulation covers scenario-based costing you can apply before you book. Browse learning modules →